K8418A

Hyper-Reliable Liquid Flux,
No-Clean, low solid
K8418A is formulated with a proprietary activator system with low percentage of rosin for improving thermal stability.  It is a highly active, no-clean flux performed the broadest process window with low defects rates. K8418A provides excellent solderability even when the surfaces to be soldered (components leads and pads) are not good solderable.  

It works particularly well with the bare copper boards for which protected with organic or rosin coatings. The K8418A performances assure you trouble free compliance with new environmental regulations.
Main physical properties.

Industry Classification (Flux Composition)
K8418A is a rosin based No-Clean flux. The material is classified as rosin type (symbol RO) per IPC J-STD-004B.  


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1. K8418A Surface Insulation Resistance (SIR)

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2. Copper Mirror Corrosion Test (IPC-TM-650, Test method 2.3.32)

Objective:  
The purpose of this test is to help define the level of activity of the flux and determine the corrosive (halide free) properties of a flux. 

Procedures:
Flux is applied to copper-coated glass slide and sits in a controlled environment al chamber (23±2℃, 45~55%RH) for 24hours.  


3. Copper Plate Corrosion – Passed

Objective:  
The purpose of this test is to determine the corrosive (halide free) properties of a flux.

Procedures:
Flux is applied to copper-coated glass slide and sits in a controlled environment  (40℃, 93%RH, 72h)

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4. Quantitative Halides (Cl, Br)(IPC-TM-650, Test method 2.3.28.1)

Objective:  
The purpose of this test is to determine the total halide concentration of a flux.

 
Procedures:
Flux is dissolved to pre-determined concentration.  Extracted solutions are then analyzed using an ion chromatograph with 3 to 5 level calibration.  Total halide content is calculated and reported at Cl equivalent.

Results: Total halides <0.5% Cl equivalent

5. K8418A –Wetting / Spreading 

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